This technology is a digital polar phased array transmitter architecture for wireless communication in the millimeter-wave spectrum (30-300 GHz).
The growing use of low-frequency radio frequency (RF) bands due to adoption of commercial wireless standards poses increasing challenges in providing high-speed peripheral and backhaul wireless communication. Although still largely available, the millimeter-wave spectrum has seen little use because the high attenuation experienced by signals in these bands limits their use in applications requiring stable long-range wireless connections. Although attenuation can be reduced by increasing signal intensity, existing high-power transmitters generally make use of bulky high-gain components that are not amenable to compact integrated fabrication.
This technology employs multiple stacked digital-to-analog converters (DACs) that can produce high-power output suitable for stable long-range communication using a fully-integrated silicon platform. Multiple chips can be tiled in a single package to increase transmission range. The transmission beam can also be electronically steered to improve stability in adverse weather conditions. The design, therefore, obviates the need for mechanical antenna steering to maintain stable communication links.
The advantages of the technology have been confirmed using simulations.
IR CU15078
Licensing Contact: Greg Maskel