While the quantum and electronic properties of nanoparticles hold great promise for powerful, compact electronic devices, the scale-up of nanoparticle thin films has been hindered by difficulties in deposition. Uniform nanoparticle film deposition is critical for next-generation electronics applications. Conventional techniques produce rough films that are susceptible to dissolution during fabrication. This technology provides a scalable, cost-competitive method for controlled nanoparticle deposition onto electrodes, resulting in high quality, durable thin films. The resulting electrodes are useful for various applications from photovoltaics to flexible electronic devices.
This technology provides inexpensive, scalable ways of depositing thin film electronic layers with fewer gaps than existing methods. Using an applied voltage, this technology draws the ligand-coated nanoparticles to charged electrodes. Tuning the deposition voltage and duration enables controllable growth of films of different thicknesses. Additionally, the use of patterned electrodes enables location-specific deposition, a improvement on conventional techniques such, as spin casting and dry casting, that cannot achieve such location-specific deposition or uniform thickness control.
Films produced using this technology are stable and robust, as indicated by sustained photoluminescence signals emitted months after deposition and resistance to dissolution upon reverse biasing or immersion in solution.
Patent Issued (US [7,510,638])( http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7510638.PN.&OS=PN/7510638&RS=PN/7510638))
Tech Ventures Reference: IR M02-027