Easy-to-integrate thin-films with tunable optical, electrical, and thermal properties
This technology is a solution-based processing method for constructing superatomic thin-films, which facilitates their integration into electronic and thermoelectric devices.
Unmet Need: Solution-based method for building designer atomic solids
Superatomic thin-films possess remarkable physical qualities that render them as attractive functional materials for electronic and thermoelectric devices. However, current methods of building designer atomic solids typically yield powder-based materials, which precludes their easy integration into functional devices and systems. In view of this, solution-based methods capable of producing atomically precise thin-films are needed to facilitate their physical incorporation into useful devices.
The Technology: Solution-processable superatomic thin-films with exceptional properties
This technology is a solution-based processing method for constructing superatomic thin-films using nanoscale, atomically precise clusters. The clusters contain long and flexible side-chains, which restrict molecular electrostatic attractions and prevent powder formation, such that the materials can be suspended in solution without sacrificing performance. These clusters form amorphous and homogenous thin-films with extremely high electrical conductivity, ultra-low thermal conductivity and high optical transparency. As such, this technology provides a route towards easy integration of atomic thin-films into functional devices and coatings.
Applications:
- Electronic and thermoelectric devices
- Transparent conducting films for smart phones and other smart devices
- Transparent insulation material
- Material-integrated temperature sensor
- Flexible electronics
Advantages:
- Solution-based manufacturing method for superatomic thin-films
- Can be spin-coated onto variety of substrates
- Can be easily integrated into devices and coatings
- High optical transparency
- High electrical conductivity
- Ultra-low thermal conductivity
Lead Inventor:
Patent Information:
Related Publications:
Tech Ventures Reference:
IR CU19396
Licensing Contact: Greg Maskel