Easy-to-integrate thin-films with tunable optical, electrical, and thermal properties

This technology is a solution-based processing method for constructing superatomic thin-films, which facilitates their integration into electronic and thermoelectric devices.

Unmet Need: Solution-based method for building designer atomic solids

Superatomic thin-films possess remarkable physical qualities that render them as attractive functional materials for electronic and thermoelectric devices. However, current methods of building designer atomic solids typically yield powder-based materials, which precludes their easy integration into functional devices and systems. In view of this, solution-based methods capable of producing atomically precise thin-films are needed to facilitate their physical incorporation into useful devices.

The Technology: Solution-processable superatomic thin-films with exceptional properties

This technology is a solution-based processing method for constructing superatomic thin-films using nanoscale, atomically precise clusters. The clusters contain long and flexible side-chains, which restrict molecular electrostatic attractions and prevent powder formation, such that the materials can be suspended in solution without sacrificing performance. These clusters form amorphous and homogenous thin-films with extremely high electrical conductivity, ultra-low thermal conductivity and high optical transparency. As such, this technology provides a route towards easy integration of atomic thin-films into functional devices and coatings.

Applications:

  • Electronic and thermoelectric devices
  • Transparent conducting films for smart phones and other smart devices
  • Transparent insulation material
  • Material-integrated temperature sensor
  • Flexible electronics

Advantages:

  • Solution-based manufacturing method for superatomic thin-films
  • Can be spin-coated onto variety of substrates
  • Can be easily integrated into devices and coatings
  • High optical transparency
  • High electrical conductivity
  • Ultra-low thermal conductivity

Lead Inventor:

Colin Nuckolls, Ph.D.

Patent Information:

Patent Pending

Related Publications:

Tech Ventures Reference: