The resolution of conventional optical imaging techniques is diffraction-limited to approximately half the wavelength of the light. Superresolution imaging at resolutions below the diffraction limit are needed to capture small structures of interest such as cells and proteins. This technology presents a superresolution imaging technique that employs superlenses comprised of microspheres to obtain far-field images of structural surfaces. The imaging platform consists of a nano-positioning device featuring a cantilever and an optically transparent microsphere lens coupled to the distal end of the cantilever. The microsphere is aligned such that it lies in the optical path between the objective and the sample, allowing for fine control.
Currently available techniques for imaging below the diffraction limit can include complex and/or cumbersome equipment and may require significant processing time due to narrow spectrum light sources, fluorescent samples, expensive optical detection equipment, and/or intensive data processing techniques. Unlike near-field scanning optical microscopy (NSOM), which is limited to near-field imaging, the current technology may readily obtain far-field images. Far-field images are procured by preserving the high-resolution information in the near field through microspheres (e.g. silicon-dioxide) and forming virtual images that are picked up by a conventional objective in the far-field. The positions of these microspheres below the AFM tip may be fine-tuned, improving upon previous spherical superlens imaging methods. Furthermore, unlike stimulated emission depletion (STED) microscopy, this technique is fluorescence-free. This superresolution system facilitates inspection and diagnosis of modern nanotechnology products with nanoscale features.
This technology was demonstrated by imaging differential localization in primary cilia organelles.
Patent Pending (WO/2013/043818)
Tech Ventures Reference: IR CU12088