Columbia Technology Ventures

Photonic funnel structure for seamless fiber-to-waveguide coupling

This technology is a photonic funnel structure for efficient and alignment-tolerant coupling of optical fiber to waveguide.

Unmet Need: Robust, efficient, and low-cost process for coupling light in and out of nanophotonic devices

Current methods for coupling light in and out of photonic devices require tedious, expensive and time-consuming active alignment and manual assembly processes in order to reduce efficiency losses due to misalignment. Mass production and commercialization of nanophotonics have been hindered by the lack of robust, passive, and misalignment-tolerant methods for packaging optical interfaces.

The Technology: Alignment tolerant and high-bandwidth photonic funnel for fiber-waveguide coupling

This technology is a 3D polymer photonic funnel structure that mechanically and optically couples the optical fiber to a waveguide without any additional alignment tools or active alignment. Unlike conventional fiber-to-waveguide couplers, this passive coupler has high efficiency, high bandwidth, and high alignment tolerance without any tradeoffs. The structure allows for seamless integration of coupling techniques, and the polymer funnel can be fabricated through 3D nanoprinting using two-photon-based absorption of the photoresist. This technology also includes a system capable of automating this process. As such, this technology allows for efficient precision coupling of optical fibers to waveguides and enables scalable, cost-effective production of nanophotonic devices.

This technology has been validated with experimental data.

Applications:

  • Integrated optical devices
  • Photonic integrated circuits
  • Packaging mass-produced photonic devices
  • Optoelectronics

Advantages:

  • High alignment tolerance
  • Couples fiber to waveguide without additional alignment tools
  • Robust
  • High efficiency
  • Low cost
  • Potential for automation
  • Compatible with fabrication and automated assembly techniques

Lead Inventor:

Michal Lipson, Ph.D.

Patent Information:

Patent Issued (US 10,962,720)

Related Publications:

Tech Ventures Reference: