Ultrathin material for terahertz emission and ultrabroadband detection
This technology is an ultrathin van der Waals semiconductor platform for terahertz (THz) emission and ultrabroadband detection that enables high-speed and high-resolution communications, sensing, and imaging.
Unmet Need: Compact, wide-range THz emission and detection
Current technology for THz emission and detection is constrained by small bandwidth and low detection sensitivity, where unfavorable absorption of THz radiation and mismatched electro-optic properties remain limiting factors. Existing crystals for THz spectroscopy, such as GaP, require thick 200-micron sheets and face challenges with integration into micrometer-scale technologies such as on-chip systems. There is a critical need for lightweight, ultrathin electro-optic materials that can achieve both near- and far-field THz detection with high sensitivity for applications in spectroscopy, communications, security, and diagnostic sensing.
The Technology: Lightweight stackable platform for ultrabroadband THz detection
This technology uses ultrathin flakes of a ferroelectric van der Waals semiconductor as a compact terahertz emission and detection platform. The combination of sub-micron sheet thickness and very high electro-optic coefficients enables both sub-diffraction and ultrabroadband applications ranging from 0 to 15 THz. These flakes can be integrated with other 2D materials to achieve enhanced THz-based imaging with micrometer special resolution, overcoming the far-field diffraction limit of THz radiation. The stackable nature of these flakes is especially suitable for on-chip applications and integration into thin-film technologies.
Applications:
- In-situ THz spectroscopy of 2D quantum materials
- Sub-diffraction THz microscopy
- High-speed communication and networking (e.g., 6G, 7G)
- Mid-infrared detection
- Security scanning
- Diagnostic technologies
- Non-invasive scanning for sensitive materials
Advantages:
- Enhanced electro-optic properties enable sub-diffraction applications
- Micrometer- to nanometer-scale, stackable layers enable on-chip integration
- Broadband THz detection expands frequency range
- Integration with 2D materials provides enhanced spectroscopic capabilities
Lead Inventor:
Patent Information:
Patent Pending
Related Publications:
Tech Ventures Reference:
IR CU26078, CU25038
Licensing Contact: Dovina Qu