{"id":"CU26078","slug":"ultrathin-material-for--CU26078","source":{"id":"CU26078","dataset":"techtransfer","title":"Ultrathin material for terahertz emission and ultrabroadband detection","description_":"<p>This technology is an ultrathin van der Waals semiconductor platform for terahertz (THz) emission and ultrabroadband detection that enables high-speed and high-resolution communications, sensing, and imaging. </p>\r\r<h2>Unmet Need: Compact, wide-range THz emission and detection</h2>\r\r<p>Current technology for THz emission and detection is constrained by small bandwidth and low detection sensitivity, where unfavorable absorption of THz radiation and mismatched electro-optic properties remain limiting factors. Existing crystals for THz spectroscopy, such as GaP, require thick 200-micron sheets and face challenges with integration into micrometer-scale technologies such as on-chip systems. There is a critical need for lightweight, ultrathin electro-optic materials that can achieve both near- and far-field THz detection with high sensitivity for applications in spectroscopy, communications, security, and diagnostic sensing. </p>\r\r<h2>The Technology: Lightweight stackable platform for ultrabroadband THz detection</h2>\r\r<p>This technology uses ultrathin flakes of a ferroelectric van der Waals semiconductor as a compact terahertz emission and detection platform. The combination of sub-micron sheet thickness and very high electro-optic coefficients enables both sub-diffraction and ultrabroadband applications ranging from 0 to 15 THz. These flakes can be integrated with other 2D materials to achieve enhanced THz-based imaging with micrometer special resolution, overcoming the far-field diffraction limit of THz radiation. The stackable nature of these flakes is especially suitable for on-chip applications and integration into thin-film technologies. </p>\r\r<h2>Applications:</h2>\r\r<ul>\r<li>In-situ THz spectroscopy of 2D quantum materials </li>\r<li>Sub-diffraction THz microscopy </li>\r<li>High-speed communication and networking (e.g., 6G, 7G) </li>\r<li>Mid-infrared detection </li>\r<li>Security scanning </li>\r<li>Diagnostic technologies </li>\r<li>Non-invasive scanning for sensitive materials </li>\r</ul>\r\r<h2>Advantages:</h2>\r\r<ul>\r<li>Enhanced electro-optic properties enable sub-diffraction applications </li>\r<li>Micrometer- to nanometer-scale, stackable layers enable on-chip integration </li>\r<li>Broadband THz detection expands frequency range </li>\r<li>Integration with 2D materials provides enhanced spectroscopic capabilities </li>\r</ul>\r\r<h2>Lead Inventor:</h2>\r\r<p><a href=\"https://www.chem.columbia.edu/content/xiaoyang-zhu\">Xiaoyang Zhu, Ph.D.</a> </p>\r\r<h2>Patent Information:</h2>\r\r<p>Patent Pending</p>\r\r<h2>Related Publications:</h2>\r\r<ul>\r<li><a href=\"https://pubmed.ncbi.nlm.nih.gov/40169796/\">Handa T, Huang CY, Li Y, Olsen N, Chica DG, Xu DD, Sturm F, McIver JW, Roy X, Zhu X. “Terahertz emission from giant optical rectification in a van der Waals material” Nat Mater. 2025 Aug 24; 24(8): 1203-1208.</a> </li>\r</ul>\r\r<h2>Tech Ventures Reference:</h2>\r\r<ul>\r<li><p>IR CU26078, CU25038</p></li>\r<li><p>Licensing Contact: <a href=\"mailto:techtransfer@columbia.edu\">Dovina Qu</a></p></li>\r</ul>","tags":["Diffraction-limited system","Ferroelectricity","Microscopy","Quantum tunnelling","Semiconductor","Single-layer materials","Spectral line","Spectroscopy","Terahertz radiation","Thin film"],"file_number":"CU26078","collections":[],"meta_description":"Ultrathin van der Waals ferroelectric platform enables 0–15 THz emission/detection, on-chip, ultrabroadband imaging and sensing.","apriori_judge_output":"{\"scores\":{\"novelty\":4.0,\"potential_impact\":4.0,\"readiness\":3.0,\"scalability\":4.0,\"timeliness\":3.0},\"weighted_score\":3.9,\"risks\":[\"Technology is at early integration stage with 2D materials; demonstrated in related research but not yet proven in full system apps\",\"Fabrication yield and integration challenges with heterostructures\",\"Market adoption uncertainty for THz on-chip platforms\",\"Potential IP and standardization hurdles in terahertz ecosystem\"],\"one_sentence_take\":\"Strong novelty and potential impact with good scalability, but readiness and timeliness depend on further integration demonstrations and addressing fabrication challenges.\"}","inventors":["Chun-Ying Huang","Daniel G. Chica","Taketo Handa","Xavier Roy","Xiaoyang Zhu"],"manager":"Dovina Qu","depts":["Chemistry"],"divs":["Faculty of the Arts & Sciences"],"date_released":"2026-07-10"},"highlight":{},"matched_queries":null,"score":0.0}