Columbia Technology Ventures

Flexible implantable probe for large-scale wireless neural stimulation and recording

This technology is a flexible complementary metal-oxide-semiconductor (CMOS) penetrating probe that can be implanted in the brain for neural stimulation and recording.

Unmet Need: A narrow and flexible probe for wireless brain activity monitoring and stimulation

Current methods of chronic monitoring and stimulation of neural activity are done by inserting electrodes into areas of interest in the brain. The process often leads to tissue inflammation, resulting in altered responses. Additionally, data transmission and probe control rely on through-skull connections that are prone to interference. Thus, there remains a need for less invasive probes that can be powered and transmit data wirelessly through the skull.

The Technology: High-resolution flexible neural probe with wireless control

The technology is a high-resolution implantable CMOS neural probe that wirelessly couples to an external reader. The probe is small, made of a flexible material, and aims to decrease brain tissue disturbance. Furthermore, the battery-independent system is powered by the external reader via near-field coupling. The number of independent probes that can be used with the same reader can be varied making the system dynamic and scalable. Furthermore, wireless powering and data transmission simplifies the process and decreases the chances of interference.

Applications:

  • Neural stimulation therapies
  • Monitoring effects of neural stimulation
  • Neural prostheses

Advantages:

  • Large-scale neural stimulation and recording of multiple brain areas simultaneously
  • High resolution due to high electrode density
  • Narrow width and flexible material decrease tissue inflammation and gliosis
  • Modular architecture enables scalability
  • Battery independent
  • Optimized power efficiency
  • Wireless powering and data transmission
  • Low data interference

Lead Inventor:

Kenneth Shepard, Ph.D.

Patent Information:

Patent Issued

Related Publications:

Tech Ventures Reference: