Easy-to-integrate thin-films with tunable optical, electrical, and thermal properties

Quick Facts:
Tags: Electrical resistivity and conductivity, Nanoscopic scale, Thermal conductivity, Thermal insulation, Thin film, Transparency and translucency
Inventors: Alexander D. Christodoulides, Amirali Zangiabadi Ph.D., Boyuan Zhang, Christine McGinn, Colin Nuckolls, Elena Meirzadeh, Ioannis John Kymissis, Jingjing Yang, Jonathan A. Malen, Lingyun Dai, Michael Steigerwald, Qizhi Xu, Samuel Robert Peurifoy, Xavier Roy
Manager: Greg Maskel
Departments: Center for Integrated Science & Engineering (CISE), Chemistry, Electrical Engineering, Mechanical Engineering
Divisions: Faculty of the Arts & Sciences, FAS & SEAS, Fu Foundation School of Engineering and Applied Science (SEAS)
Reference Number: CU19396
Release Date: 2020-07-21

This technology is a solution-based processing method for constructing superatomic thin-films, which facilitates their integration into electronic and thermoelectric devices.

Unmet Need: Solution-based method for building designer atomic solids

Superatomic thin-films possess remarkable physical qualities that render them as attractive functional materials for electronic and thermoelectric devices. However, current methods of building designer atomic solids typically yield powder-based materials, which precludes their easy integration into functional devices and systems. In view of this, solution-based methods capable of producing atomically precise thin-films are needed to facilitate their physical incorporation into useful devices.

The Technology: Solution-processable superatomic thin-films with exceptional properties

This technology is a solution-based processing method for constructing superatomic thin-films using nanoscale, atomically precise clusters. The clusters contain long and flexible side-chains, which restrict molecular electrostatic attractions and prevent powder formation, such that the materials can be suspended in solution without sacrificing performance. These clusters form amorphous and homogenous thin-films with extremely high electrical conductivity, ultra-low thermal conductivity and high optical transparency. As such, this technology provides a route towards easy integration of atomic thin-films into functional devices and coatings.

Applications:

  • Electronic and thermoelectric devices
  • Transparent conducting films for smart phones and other smart devices
  • Transparent insulation material
  • Material-integrated temperature sensor
  • Flexible electronics

Advantages:

  • Solution-based manufacturing method for superatomic thin-films
  • Can be spin-coated onto variety of substrates
  • Can be easily integrated into devices and coatings
  • High optical transparency
  • High electrical conductivity
  • Ultra-low thermal conductivity

Lead Inventor:

Colin Nuckolls, Ph.D.

Patent Information:

Patent Pending

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