Columbia Technology Ventures

This technology is a technique to treat individuals experiencing subfertility using a capsid-based drug delivery system.

Unmet Need: Non-invasive method to promote fertility

Current methods to treat subfertility involve the use of assisted reproductive technology (ART) which is often invasive, expensive, and involves varying success rates. Additionally, ART is not a successful approach to treat subfertility due to maternal age. A potential alternative to such treatments is using endogenous factors to promote fertility through a less invasive and more natural approach. However, there are currently no platforms that can promote fertility in this way.

The Technology: Method to treat subfertility using endogenous capsid-like structures

This technology describes capsid-like structures that contain molecular cargo and can be released from reproductive tissues like ovaries and testes. These capsid structures are stable outside of the cell for over a month when stored properly and can be purified from bioengineered cell lines or mammalian tissues to then be administered non-invasively. Thus, this technology describes a less expensive and invasive drug delivery system for both men and women experiencing subfertility influenced by a range of factors, including advanced maternal age.

Applications:

  • Pro-fertility treatment for women and men
  • Fertility treatment for women at advanced maternal age
  • Fertility treatment for individuals with endometriosis, ovular dysfunction, low sperm count, and erectile dysfunction
  • Supplement for geriatric and higher-risk pregnancies
  • Research tool for the study of the relationship between capsids and fertility
  • Research tool to study cell-to-cell capsid transfer

Advantages:

  • Capsid-based drug delivery
  • Compatible for use to treat both male and female subfertility
  • Relatively stable outside of cells
  • Non-invasive administration
  • Deliverable via injection

Lead Inventor:

Luke Berchowitz, Ph.D.

Patent Information:

Patent Pending

Related Publications:

Tech Ventures Reference: