Hybrid silicon film crystallization method for large panels and higher performance

This technology describes a method of using high velocity continuous wave (CW) laser scans along with sequential lateral solidification (SLS) to crystalize large panels of silicon films.

Unmet Need: Rapid and high-speed crystallization of film on large panel areas

Current, CW laser crystallization may be used to produce surface-texted silicon films. However, CW crystallization requires multiple scans and can introduce significant heat, damaging the glass substrate. CW laser scanning can be optimized at a velocity of 1 m/s, but does not serve as a feasible method for large panel area scans. A hybrid solution of CW laser and SLS has been tested. However, pre-crystallization of entire film panels is time consuming and limited by the power of the laser used in CW.

The Technology: Hybrid continuous wave and sequential lateral solidification crystallization method

This technology describes a method of typical SLS scanning at higher velocities by varying its directional scanning. Multiple high-speed CW scans over a narrow integration region of a liquid crystal display (LCD) will produce a strong crystalline surface texture without substrate damage. Further, SLS can be used to optimize the film’s surface structure to further enhance thin-film transistor (TFT) performances. Overall, this technique will allow CW scans at high velocities compatible with glass substrates over a large panel and offers higher performance of TFTs in its integration regions.

Applications:

• Production of high performance TFTs and LCDs from glass
• Rapid and optimized crystallization process
• Production method for imaging sensors and LCDs

Advantages:

• Uses high velocities scans and lower costs due to optimization
• Reduces substrate heating from multiple scans
• Scans over larger panel areas
• Improves TFT performance in LCDs
• Compatible with glass substrates

Lead Inventor:

James Im, Ph.D.

Patent Information:

Patent Status

Related Publications:

• van der Wilt PC, Turk BA, Limanov AB, Chitu AM, Im JS. “A hybrid approach for obtaining orientation-controlled single-crystal Si regions on glass substrates” Photon Processing in Microelectronics and Photonics V. 2006 Mar 1; 6106: 61060B.

Tech Ventures Reference:

• IR M06-028

• Licensing Contact: Greg Maskel