Integrated silicon photonic band interleaver

This technology is an integrated silicon photonic band interleaver for the optimization of spectral sensing throughput for data communication applications using on chip wavelength division multiplexing.

Unmet Need: Bandwidth bottleneck in data throughput

Emerging silicon photonic link designs aim to attain remarkable bandwidth density and energy efficiency levels. Nevertheless, the overall bandwidth of carriers faces limitations imposed by the free spectral range, and integrating photonic components with conventional integrated circuit electronics systems continues to present a significant challenge.

The Technology: Integrated, compact, and tunable band-interleaving

This technology is an integrated silicon photonic device based on a ring-assisted Mach Zehnder Interferometer. It can interleave bands of the optical spectrum to multiplex or demultiplex content with thermally and optically tunable pass and stop bands. The technology also displays a high free spectral range (FSR) with a sharp roll-off allowing it to greatly increase the effectiveness of spectral sensing and analysis.

Applications:

• Spectroscopic sensing applications
• Spectral filtering
• De-multiplexing
• Data communication
• On-chip communications
• Optic solutions

Advantages:

• Highly tunable pass and stop bands
• Multiple-factor tuning (thermal and optical)
• Wide free spectral range (FSR)
• Sharp roll-off

Lead Inventor:

Keren Bergman, Ph.D.

Patent Information:

Patent Pending

Related Publications:

• Novick A, Wang S, Rizzo A, Parsons R, Jang K, Bergman K. "Tunable and Compact SiP Quasi-Dichroic Filter with ≥ 10 dB/nm Roll-Off Across C- & L-bands" 2022 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), 2022 Sep: pp. 171-172

Tech Ventures Reference:

• IR CU23236

• Licensing Contact: Greg Maskel