Topical application of engineered yeast for faster wound healing
This technology is a topical hydrogel/cream containing genetically engineered yeast that continuously secretes human CXCL12 and EGF to speed up wound healing and reduce complications.
Unmet Need: Faster and infection-resistant wound healing
The natural healing process can be time-consuming, and chronic wounds such as diabetic ulcers, burns, and other topical diseases can be life-threatening if left untreated. Without a proper dressing, they heal slowly and unevenly, increasing the risk of infection, re-injury, and other complications. Epidermal growth factor (EGF) is recognized as an excellent wound healing agent due to its ability to stimulate skin cell growth, proliferation, and differentiation. However, current EGF dressings are not sustained and long-lasting, requiring frequent re-application and a lengthy healing process.
The Technology: Sustained release of wound-healing factors using engineered yeast
This technology leverages topical application of engineered yeast strains to secrete two wound-healing factors: epidermal growth factor (EGF) and chemokine CXCL12 (SDF-1). Embedded in hydrogel or cream, the yeast survives long enough to provide continuous, physiologic-level release of both proteins through the critical inflammatory and proliferative phases of wound repair. Animal studies demonstrate that the yeast hydrogel closes wounds faster than blank dressings, purified growth-factor hydrogels, and single-strain yeast formulations, demonstrating synergistic and sustained activity without the cost or instability of purified biologics.
This technology has been validated in vivo using mouse models.
Applications:
- Acute trauma care for military and emergency use
- Chronic wound management
- Post-surgical incision dressing
- Burn treatment
- Veterinary medicine
- Cosmetic dermatology for reduced scar
Advantages:
- Sustained, on-site protein production maintains therapeutic levels for days without re-application
- Dual application of CXCL12 and EGF accelerates healing beyond single-agent products
- Reduced infection and scarring
- Simple topical solution
- Cost-effective
Lead Inventor:
Patent Information:
Patent Pending (US20240285701)
Related Publications:
Tech Ventures Reference:
IR CU22252
Licensing Contact: Joan Martinez